Assembly Workmanship: Wirebond
Assembly Workmanship Contents
Wire bonding today is used throughout the microelectronics industry as a means of interconnecting the chips, substrates and output pins. A small diameter wire is "bonded" to the aluminum pads on the IC and looped to the appropriate connection on the package or substrate, where it is bonded and cut.
Wirebond Criteria: |
After K & S Micro-Swiss |