Die Products Tutorials
Getting Started with Die Products
Introduction to Die Products
Discusses how the benefits of unpackaged die allow designers to overcome the challenges of small form factor applications.
Myths of KGD
Larry Gilg debunks four myths about Known-Good-Die (KGD).
Learn how Known-Good-Die (KGD) processing allows for better yields and improved short-term reliability.
Application Case Studies
Teardown analyses illustrating innovative uses of die products in four different applications.
System-in-Package (SiP) Assembly
Combines all of the electronic components (digital ICS, analog ICs, RF ICs, passive components or other elements) needed to provide a system or subsystem in one package, as an alternative to an SoC.
Flip Chip Assembly
Offers optimized electrical performance in addition to optimized miniaturization.
Chip-on-Board (COB) Assembly
Provides the capability to perform direct chip to chip wiring that facilitates improved performance and strong functional integration in many modern high speed applications.
Overview of Challenges in Bare Die Mounting (pdf)
an article by Larry Gilg of the DPC.
Quality & Reliability
Visual Inspection Criteria
A compilation of visual criteria for the inspection of unpackaged die and wafers.
Assembly Workmanship Criteria
A compilation of criteria covering die placement, encapsulation, spacing, wirebond, and rebonding.
Storage, Handling, & Shipping of Die Products
The DPC developed this guide to supplement the safe handling guidelines for packaged ICs that are practiced in the Surface Mount Technology (SMT) assembly industry, and to provide information to purchasers of wafer and die products.
Die Products Standards
An overview of international standards that focus on the unique information that must be available for successful application of die products in electronic assembly.