Residual wires remaining from a broken bond pad shall not exceed two wire diameters in length. No residual wire may exceed 10 mils regardless of wire diameter.

When rebonding on top of an existing bond nugget, the new bond shall be at least 75 percent on top of bond nugget.

When rebonding the height of the stack shall not be more than one rebond and one nugget high.

Rebonds that are placed on bond pads shall be placed on undisturbed metallization and have sufficient pad area so that the bond foot will meet the requirements called out in this section.

Rebonds shall not be performed over pad areas where the previous bond has been removed leaving cracks, craters, or other disturbed metallization.

Probe marks which have burnished the bond pad but not damaged the surface shall be acceptable and not be considered a "disturbance" of the pad.

Rebonds shall not be partially off-set on top of another bond wire tail.