Die oriented shall be in accordance with the applicable assembly drawing. Die shall not be rotated more than 10 degrees with respect to the package cavity or the design location.

Die adhesive shall be visible at the perimerter of at least 50 percent of the die.

Adhesives shall not come closer than 1.0 mil (visible separation) to the top of a die

Spatters or strings of adhesive shall:

• not be able to break loose
• have a visible fillet and
• not reduce the separation between metallizations to less than 1.0 mil.

Crack(s) in the adhesive around the perimeter of the die shall not be:

• longer than 5.0 mils in length or
• 10 percent of the width of the die, whichever is greater.

Note: Irregularities such as fissures at the outer edge of the adhesive are not considered cracks.

There shall be a visible line of separation between adhesive and to adjacent unattached circuitry or metallization.