Die Products Consortium (DPC)

The Die Products Consortium (DPC) is a group of leading microelectronic companies collaborating to expand the market for semiconductor die products, with a focus on:

bare and bumped die
known-good die (KGD) processes
chip-on-board (COB) and flip-chip
stacked (3D) system-in-package (SiP)
wafer-level chip-scale packaging (WL-CSP)

Ongoing DPC projects promote improved quality, reliability, handling, shipping, and associated infrastructure for semiconductor die products.

The DPC is open to new members. Find out how to join.

About the DPC
Overview of DPC activities, mission, participating companies, and how to join.
Projects
Technical collaborations, standards, & roadmapping activities.
Tutorials
Shipping & handling, assembly, test & inspection methods.
Resource Library
Sources for information on die products.
News
Recent news and events of the DPC and the die products industry.

Latest News	Tutorial Spotlight	Member Spotlight
Industry Leaders Seeking Adaptive Test Solutions A subgroup of members of the Die Products Consortium, the AC Defects test team, is focused on a new generation of test and reliability methods for leading edge semiconductor devices known as Adaptive Test. The group sponsored a unique meeting with third party vendors of Adaptive Test solutions in Sa... ...more	Die Product Application Case Studies Die products are increasingly the solution of choice within the mobile and consumer electronics markets. The DPC has worked with Portelligent, Inc. to provide teardown reports to illustrate innovative uses of die products in today's applications. ...more	NXP is a newly independent semiconductor company (founded by Philips) with a fifty-year history of providing engineers and designers with semiconductors and software that deliver better sensory experi... ...more

Latest News

Tutorial Spotlight

Member Spotlight

Industry Leaders Seeking Adaptive Test Solutions

A subgroup of members of the Die Products Consortium, the AC Defects test team, is focused on a new generation of test and reliability methods for leading edge semiconductor devices known as Adaptive Test. The group sponsored a unique meeting with third party vendors of Adaptive Test solutions in Sa...

...more

Die Product Application Case Studies

Die products are increasingly the solution of choice within the mobile and consumer electronics markets. The DPC has worked with Portelligent, Inc. to provide teardown reports to illustrate innovative uses of die products in today's applications.

...more

NXP is a newly independent semiconductor company (founded by Philips) with a fifty-year history of providing engineers and designers with semiconductors and software that deliver better sensory experi...
...more