Storage, Handling, and Shipping Guidelines
Die/Wafer Storage, Handling, and Shipping Contents
This guide has been developed by the DPC to supplement the safe handling guidelines for packaged ICs that are practiced in the Surface Mount Technology (SMT) assembly industry, and provide information to purchasers of wafer and die products.
Die/Wafer Storage
Proper storage conditions are necessary to prevent product contamination and/or degradation after shipment.
Product should be stored in original unopened packaging or, once opened, in a Nitrogen purged cabinet (45% +/- 15% RH controlled environment) at room temperature.
Sawn wafers mounted on dicing tape are intended for immediate use and have a limited shelf life. This is primarily due to the nature of the adhesive tape used for mounting the product. This product can be stored for up to 30 days regardless of whether or not the material has remained in its original sealed container.
To reduce the risk of contamination or degradation, it is recommended that product not being used in the assembly process be returned to their original containers, purged with N2 and resealed with a vacuum seal process.
In all cases, the customer must determine the applicability of extended storage durations and conditions with respect to their assembly process and end product criteria.