Die/Wafer Shipping Technologies
Die/Wafer Storage, Handling, and Shipping Contents
Use of proper shipping materials is essential in protecting die and wafer products while in transit from supplier to the customer. The primary concerns are shielding the product from moisture, ESD, and mechanical damage.
Dessicant is critical to protect product from damage due to moisture.
Waffle pack vacuum-sealed with dessicant inside an ESD shielding moisture barrier bag. Nitrogen purge prior to evacuation of the bag is recommended. |
Wafer Vial vacuum-sealed inside a moisture barrier bag with dessicant. |
Wafer Cassette vacuum-sealed with dessicant inside a moisture barrier bag. |
Sealed product is placed inside a corrugated cardboard box surrounded by bubble wrap or foam for maximum protection during shipment. |