Die Products Standards
Standards Contents
The die products industry has matured to the point that many customers can obtain the die products they need, at the right price, with the quality and reliability needed to realize profits. The next hurdle to attack is the simplification of the procurement transaction itself.
Users of bare die require more information than users of packaged ICs in order to design, handle and assemble the die product correctly. To enable transactions between buyers and sellers, minimum requirements for transfer of the unique die-related information must be defined, stated simply in direct terms, and be defensible with data.
An international standard is now being developed that focuses on the unique information that must be available for successful application of die products in electronic assembly. Implementation of an appropriate standard will enable a more robust business model for both the buyer and seller. The DPC is taking a lead role in the development of this IEC International Die Products Standard.
In addition, JEDEC's JC-13 committee has agreed to broaden the scope of JESD 49 to include die products (it originally focused exclusively on KGD), and will add a section detailing the specific requirements for KGD, or other special die requirements that supercede the base document.