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Flip Chip Assembly References

Flip Chip Assembly Contents

  1. John Lau, Low Cost Flip Chip Technologies. McGraw-Hill, 2000
  2. Michael A. Previti, "No Flow" Underfill Reliability is Here . Cookson Semiconductor Packaging Materials Application note. http://www.cooksonsemi.com/tech_art/pdfs/NUF%20Reliability%20is%20Here.pdf
  3. Kauto Nishida, et al, High Density Packaging Using Flip Chip Technology in Mobile Communication Equipment . Proceedings of 2001 International Symposium on Microelectronics, P272-277(2001)
  4. John Lau, Low Cost Flip Chip Technologies . McGraw-Hill, 2000
  5. John Lau, Flip Chip Technologies , McGraw-Hill, 1996.
  6. Philip Garrou, Wafer Level Chip Scale Packaging (WL-CSP); An Overview . IEEE Transactions on Advanced Packaging, Vol. 23, No. 2, May 2000
  7. Caswell, Greg, and Partridge, Julian, BGA to CSP to Flip chip - Manufacturing Issues . ICEP 2001, International Conference on Electronic Packaging, Tokyo , Japan , April 18-20, 2001