Visual Inspection: Delamination
Visual Inspection Contents
Active circuit metallization shall have no delamination, blistering, or peeling in glassivation, metal, sub-level dielectrics or other layers.
There shall be no delamination, blistering, or peeling in glassivation, metal, sub-level dielectrics or other layers that may be in contact or under active circuit metallization.
Courtesy Rockwell Collins