Quality & Reliability
Die products look different than packaged semiconductors. Therefore, die and assembly inspection criteria are developed that address the requirements for these devices. DPC members have compiled the following guidelines to assist die users in this area.
General Guidelines and Definitions for Handling Die
Visual Inspection Criteria - A compilation of visual criteria for the inspection of unpackaged die and wafers.
Assembly Workmanship Criteria - A compilation of criteria covering die placement, encapsulation, spacing, wirebond, and rebonding.
Chip on Board (COB) Reliability
Other Inspection Resources:
August Technology's KGD Wafer Level Packaging Inspection Tutorial
National Semiconductor's Visual Inspection Guidelines