Samsung SPH-X4200 Cellular Phone
The Samsung SPH-X4200 was officially released in January 2002 by Korean Telecom FreeTel, a Korean wireless carrier, and is available only on the Korean market. The CDMA 2000 phone is Qualcomm BREW -enabled and allows KTF's subscribers of Magic n Multipack service to download color applications from the Anycall.com website, including games, subway maps, comics, music video, etc. The cell phone also features an exceptionally bright color display, a 2400 entry phonebook, and data rates of up to 153.6 kbps.
Components of Interest
- Adhesive Flip Chip on Flex
Using Anisotropic Adhesive Flip Chip Bonding to Flexible circuits is becoming a popular alternative to other direct chip attach technologies such as COB and TAB; particular with display modules where the technology was first used to attached display driver ICs to glass. - Stacked Memory Packages
Stacked memory packages were introduced in the late ’90s by Toshiba, Fujitsu, Sharp, Mitsubishi, and NEC as a means to significantly reduce circuit board area. Today’s portable products – particular cellular phones - may contain memory devices from multiple sources in one package. - Solder Flip Chip On Board
After several years of much talk and many development programs, solder flip chip technology is finally seeing some use. Several vendors of small, commodity semiconductor devices and integrated passives are now offering their components as bare die with solder balls attached, ready to be directly attached to a circuit assembly. These components are typically small enough that underfilling is deemed unnecessary.
 SPH-x4200 Assemblies |
 SPH-x4200: Key Semiconductors |
 Flex Circuit for the Display with Adhesive Flip Chip IC |
 Anisotropic Conductive Film (ACF) Flip Chip Bond to Flex |
 Flip Chip On Board Component |
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Conclusions:
- Cellphone BOMs still vary widely depending on wireless standard (CDMA, GSM, TDMA, W-CDMA, etc.) and to a lesser degree vary with OEM.<
- Increasing diversity in BOM complexity as phones evolve; entry-level GSM vs. feature-rich 3G phones differ by 2X-5X in various quantitative aspects.
- Some phones are becoming increasingly packaging-challenged (3G) while others have experienced relaxing packaging requirements due to component integration (e.g. simple GSM phones).
- Packaging for the complex end of the handset spectrum is moving towards IC device stacking (the 3rd dimension).
- “Thin-is-in” for most IC device packages. While X-Y handset dimensions may be dictated by keypads, displays, batteries, and ear-to-mouth distances, few of us complain because our handset is too thin!
This report is part of an ongoing Market Intelligence Project undertaken by DPC member companies. For information on how your company can join the DPC, please contact us.