Die Products Related Organizations
ENCAST (European Network for the Co-ordination of Advanced Semiconductor Technologies)
A European initiative to promote Known-Good-Die (KGD) and all semiconductor manufacture, assembly, packaging and test technologies. Its objectives are to extend the activities that were carried out by the GOOD-DIE project and cover wafer scale packaging, stacked die and packages, SiP, SOC, flip chip, MEMS etc. and all aspects of assembly, test and reliability.
SMTA (Surface Mount Technology Association)
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
MEPTEC (Microelectronics Packaging and Test Engineering Council)
MEPTEC is a trade association of semiconductor suppliers and manufacturers, committed to enhancing the competitiveness of the back-end portion of the semiconductor business. MEPTEC is concerned exclusively with assembly and testing and is dedicated to the advancement of the industry.
IMAPS (International Microelectronics and Packaging Society)
The International Microelectronics And Packaging Society (IMAPS) is a society dedicated to the advancement and growth of the use of microelectronics and electronic packaging through professional and public education, the dissemination of information and the promotion of the Society's portfolio of technologies.
Europractice-HDP is an EC initiative which provides one-stop technology solutions where high density electronics is required.
Nordic Electronic Packaging Guidelines
A Nordic decision support guideline for the right selection of microelectronics packaging and interconnection systems
Georgia Tech Microsystems Packaging Research Center
A university-based research and education center focusing on next generation system-level packaging of electronics.