Upcoming Events
International Conference on Electronics Packaging (ICEP) 2007
April 18, 2007 - April 20, 2007
Shinagawa Prince Hotel, Tokyo, Japanhttp://www.jiep.or.jp/icep/
Advanced Technology Workshop on Automotive Packaging
April 9, 2007 - April 12, 2007
Hyatt Regency, Dearborn, MIwww.imaps.org/automotive
MEMS Symposium: MEMS in the Mainstream
May 16, 2007 - May 17, 2007
Holiday Inn San Jose (formerly Hyatt San Jose), San Jose, CASMTA International
October 7, 2007 - October 11, 2007
Gaylord Palms Hotel & Convention Center, Orlando, FL14th Annual KGD Packaging and Test Workshop
September 9, 2007 - September 12, 2007
Die Products Consortium (DPC)
Embassy Suites Napa Valley, Napa, CA
http://www.napakgd.com/
The KGD Packaging & Test Workshop returns to the Napa Valley next September 9 - 12 for 3 days of presentations on leading technologies, supplier exhibits, and networking opportunities for die products practitioners from across the industry.
The explosion of digital content for portable electronics is only possible through assembly and packaging technology that relies on die products to achieve the needed functionality in the smallest footprint.
The KGD Packaging and Test Workshop offers a focused, highly informative interchange of ideas and information on all aspects of the die products industry in a relaxed, informal setting.