PCB Guidelines for Die Products
The PCB Guidelines project focuses on substrate technologies that are suitable for die products interconnection - including wirebonded bare die, area array flip chip and wafer level chip scale packages
Project Report: PCB Design Guidelines for Chip on Board Applications
DPC members have collaborated to provide this report for designers of printed circuit boards who want to design for a low-cost bare die implementation. The guideline develops a basic understanding of issues related to moving from surface mounted packaged IC's to a chip-on-board (COB) design.