DPC Projects
DPC member companies companies collaborate on a variety of projects each year. These are a few long-term ongoing projects currently underway. For more information about any of these projects, please contact us.
Current Projects
SiP (System-in-Package) Program
The DPC SiP Program was formed to identify issues that must be addressed for stacked (3D) multichip packaging adoption and initiate an effort to develop consensus views on these issues. For more on this topic, see the SiP Assembly Tutorial.
Test Programs
The die products industry is able to take advantage of trends in the industry to perform more and better tests at the wafer level. Member companies are in the forefront of development some of these test methods, and the DPC provides the collaborative environment to allow effective dissemination of information among participants. Current programs include:
- AC Defects Consortium
This project uses the model of multi-company collaboration to share data, analyze results and explore test strategies especially aimed at detecting faults in IC devices that fail at high clock rates.
- Analog/RF Test
The RF/Analog Test Group seeks to advance the art of production testing radio frequency and mixed-signal technology by the pooling of member companies' experience and knowledge to identify challenges and share solutions.
- Fault Modeling and Test Coverage Description Project
This project is a collaborative effort to reach consensus agreement on fault Modeling and test coverage descriptions for VLSI designs.
- Mixed-Signal Zero-defects Project
This project was launched in 2006 and is becoming a popular benchmarking and information sharing activity for companies involved in provided electronics components and sub-assemblies to the Automotive, Medical, Aerospace and related high-reliability industries.
KGD Packaging and Test Workshop
Sponsored annually by the Die Products Consortium, the International KGD Packaging and Test workshop has steadily gained a reputation as an excellent source for the latest information to enable die products applications, in the areas of wafer prep., test, packing and assembly of leading edge electronic modules. For more, see the workshop website at http://www.napakgd.com
Die Products Standards
Information is key to user acceptance of new technologies. The DPC is working with the international community to develop effective die standards that will simplify procurement of die products. For more on this topic, see the Die Products Standards Tutorial
Market Intelligence and Technology Reports
The DPC draws on both internal and external resources to produce member-only market intelligence and emerging technology reports, application tear-down reports, industry surveys, and other information that assists member companies in taking full advantage of opportunities emerging in die products markets.
Completed Projects
PCB Guidelines for Die Products
Substrate selection impacts a great many aspects of a successful die products design. These include thermal management options, electrical performance, mechanical integrity and long term reliability. The DPC develops guidelines so that customers of die products can be informed on these issues. In 2003, this project team release a public report on PCB Design Guidelines for Chip on Board Applications.
Test Methods Demonstration Project
In 2002, members of the DPC concluded a multi-year experiment to demonstrate the efficacy of using test methods and reliability screens to "get out of burn-in" (GOBI). The project provided an understanding of the industry's "best practice" and developed tools that have enabled the members to determine a cost effective means to achieve reliability goals.
The DPC is open to new members. Find out more.
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