About the DPC
The Die Products Consortium (DPC) is a program of Dynalog Systems, Inc. Under the DPC program, Dynalog Systems, Inc. has invited a group of leading microelectronics companies to collaborate in enlarging the markets for die products worldwide. See current participants.
The DPC program is dedicated to providing timely, informative and thought-provoking information about insertion of die products into electronic systems. Each year, member companies participate in a variety of projects focusing on die products test, assembly, standardization, infrastructure, and market intelligence.
The DPC is an outgrowth of a close working relationship between two US consortia, MCC and Sematech, to develop technical solutions and business strategies for promoting the die products industry. The joint efforts of these consortia have included projects to develop hot chuck probing, bare die carrier analysis and evaluations for test and burn-in of KGD, shipping media evaluations, reports and recommended standards, cost modeling and analysis, with a focus on proactive international cooperation and information sharing. Dynalog Systems, Inc. started the DPC as a program in 2000.
For more information, see our DPC Overview Presentation (pdf).
The DPC is open to new members. Find out about DPC Membership.